It is often mixed with copper impurity with consistence more than 20mg/L in sulfate nickel-plating bath, which will cause nickel-plated layer’s properties deteriorated and lead parts get dark in low current density area. QT copper removal powder is specially used for removing bad copper impurity decreased in nickel-plating bath. Compared with low-current electroplating treatment and PH value increase, this method shortens electroplating time and saves nickel consumption. If add 0.2-0.4g/L QT copper removal powder quantificationally before every processing nick-plating bath every month, it will effectively eliminate the shortage that part is easy to get dark for the reason of too many copper impurities. Thus, this is a stable, reliable, quick, easy and effective method to long-term maintenance.

Method of use:

• Dissolve QT copper removal with 10 times (weight ratio) water. (As for copper removal agent: it is diluted in 1：2.)
• Add measured copper removal powder (1mg copper removal powder may remove 5mg copper ion.) into nickel bath slowly and continue to mix it for 20-30min to guarantee full reaction; then red-brown deposit will agglomerate and deposit in 1-2times, thus to be filtered.
• It is supposed to confirm the usage according to actual condition firstly for preventing superfluous copper removal powder from consuming nickel ion (Every 1g superfluous QT copper removal powder may consume about 45mg nickel ion in 100L bath.); but copper removal powder won’t influence bath’s properties.