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General failures of acid copper bath and reference of processing methods:

Failure phenomenon

Possible reason

Correcting method

weak binding force

1.bad preliminary treatment
2.too thin pre-plate
3.loose electric contact
1.Enhance preliminary treatment.
2.Strengthen pre-plate.
3.Check contact.

lack brightness

1.Lack brightener N, M or SP.
2.Lack CI- or CI-is too high.
3.high bath temperature
4.Produce copper power or Cu+1.
5.Bath is polluted by impurity.
6.Anode area is not enough.
7. loose electric contact
8. Sulfuric acid content is too high.

1. Replenish according to detailed condition.
2. Assay and adjust.
3. Reduce temperature.
4. Use phosphor anode and add H2O2.
5. Process and filter bath.
6. Increase anode area.
7. Check electric conduction.
8. Dilute and regulate solution.

lack brightness in low-current density area

  1. Lack N or M.
  2. SP is too much.
  3. Carmowax content is a little higher or lower.
  4. Cl- content is a little higher.
  5. There is copper powder or Cu+1 in bath.
  6. There are metal or organic impurities in bath.
  7. Temperature of bath is a little higher.
  8. Anode area is not enough.
  9. mixing or loose electric contact or too small current
  1. Check and replenish it.
  2. Replenish N or electroplate.
  3. Use active carbon to process or replenish properly.
  4. Add proper zinc powder to process.
  5. Check anode and replenish H2O2.
  6. Process filtrate solution.
  7. Correct it.
  8. Increase anode area.
  9. Check and correct it.

Mist is produced on electroplated layer.

  1. SP is too much.
  2. Polyglycol is too much.
  1. Replenish proper N or electroplate it.
  2. Add active carbon to process.

Electroplated layer is coarse and has pinhole.

1. bad preliminary treatment
2. too thin preliminary or bad treatment
3. Cl- is a little lower (less than 10mg/L).
4. CuSO4 content is higher than 250g/L.
5. Temperature is higher.
6. There is copper powder or Cu+1 .
7. Bath is polluted by impurity.

  1. Replenish N or electroplate it.
  2. Strength electroplating.
  3. Replenish HCl or CuCl2.
  4. Dilute or replenish it and regulate solution.
  5. Reduce temperature to regulated standard.
  6. Check and exchange anode or add H2O2.
  7. Process and filter bath.

There is bright tree-shaped strip on electroplated layer.

  1. N is too much.
  2. Cl- content is a little lower.
  1. Add SP or electroplate it.
  2. Replenish HCl or CuCl2.

There is burr on the edge.

1. SP is not enough.

1. Replenish SP.

It presents cambric shape on surface.

  1. M is too much.
  2. Carmowax is a little lower.
  1. Add SP or electroplate it.
  2. Replenish it.

Electroplated layer is burned.

  1. N or M is too much.
  2. SP is not enough.
  3. Cl- content is a little lower, less than 10mg/L.
  4. H2SO4 content is a little lower.
  5. Temperature in bath is a little lower. (less than 10℃)
  6. Bath is polluted by impurity.
  7. bad mixing;
  1. Add SP or electroplate it.
  2. Add SP.
  3. Replenish HCl.
  4. Add and replenish it.
  5. Increase temperature.
  6. Process and filter solution.
  7. Check cathode sweeping or mix it.

It appears orange peel on electroplated layer.

1. bad preliminary treatment

1. Strengthen preliminary treatment.

bad flatness

  1. N or M is not enough.
  2. Cl- content is a little lower, less than 10mg/L.
  3. Temperature is too high.
  4. There is copper powder or Cu+1 in bath.
  5. Bath is polluted by impurity.
  6. H2SO4 content is high.
  1. Add N or M.
  2. Add HCl or CuCl2.
  3. Reduce temperature.
  4. Add H2O2 to process it and check anode.
  5. Process and filter solution.
  6. Increase anode area.
  7. Dilute and regulate solution components.

Electroplated layer is thin in low-current area.

  1. SP is not enough.
  2. loose electric contact;
  1. Replenish it.
  2. Improve conductive equipment.
 
 
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